• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to an antenna support intended to be integrated into an electronic document, the support comprising: a first plastic substrate (30) delimited by a first and a second opposite face (30a, 30b) defining between them a thickness substrate (30), an antenna having at least one turn (26a) extending between two ends (26b, 26c), the antenna being formed of a wire embedded in the thickness of the first substrate (30). from the first face (30a), the two ends (26b, 26c) each having a zigzag shape formed of at least two rectilinear portions (32) and two detours (34). The detours (34) are embedded deeper than the straight portions (32) in the thickness of the first substrate (30) from the first face (30a).
    公开号:FR3023419A1
    申请号:FR1456270
    申请日:2014-07-01
    公开日:2016-01-08
    发明作者:Elodie Gragnic；Olivier Bosquet
    申请人:Oberthur Technologies SA；
    IPC主号:
    专利说明:

    [0001] The invention relates to an antenna support, also called inlay, and electronic documents such as cards or identity documents integrating such media. More particularly, the invention relates to an antenna support comprising a first plastic substrate defined by a first and a second opposite face defining between them a substrate thickness, the antenna comprising at least one coil which extends between two ends, the antenna being formed of a wire embedded in the thickness of the first substrate from the first face, the two ends each having a zigzag shape formed of at least two rectilinear parts and two detours. It is known from the prior art antenna supports intended to be inserted into an electronic document such as a microcircuit card. Antenna carriers, also called inlays, are traditionally manufactured using an ultrasound method as described in US6 233 818 and EPO 880 754. This method consists in extending a conductive wire on a substrate using a tool. , such as a sonotrode, moving above the substrate and distributing the wire. The wire is embedded in the substrate by ultrasonic vibrations transmitted from the tool to the wire. The vibrations are transmitted perpendicular to the substrate to embed the wire in the thickness of the substrate. Preferably, the wire is surrounded by a sheath that is heated for a very short period of time, which improves the adhesion of the sheath surrounding the wire in the substrate. The tool is controlled from a control means for defining the path of removal of the wire. It is thus possible to wind the thread into several turns and / or to deposit it in various forms, such as a zigzag or a lace. By zigzag or lace, is meant a sinuous line presenting curves directed alternately and in opposite directions. More particularly, a zigzag shape alternately comprises rectilinear parts and detours. This form is illustrated in the document EP 1 021 792 which describes a smart card whose ends of the antenna have a zigzag shape. These ends are intended to be electrically connected to a microcircuit mounted in the card to allow operation of the card without contact with a remote reader. However it has been found that the deposition of a wire in the form of a zigzag decreases the adhesion capabilities of the wire in the substrate. In particular, the zigzag detours have a lower adhesion rate than the rectilinear parts and tend to straighten up because of the mechanical stresses due to the folds or because of the traction exerted by the tool during the removal of the rectilinear part. consecutive. The detours thus present a higher risk of tearing and breaking of the wire, especially when handling and transporting the antenna supports. These disadvantages then result in a higher rate of electrical failure between the antenna and a microcircuit of an electronic document, rendering the electronic document invalid.
    [0002] It has therefore been sought a solution to improve the maintenance of detours in the substrate of the antenna support. For this purpose the invention proposes an antenna support intended to be integrated in an electronic document, in which the detours are embedded more deeply than the rectilinear parts in the thickness of the first substrate from the first face.
    [0003] With these provisions detours are embedded deeper into the thickness of the material constituting the substrate and are, therefore, maintained by a greater amount of material coating them. The invention also relates to an electronic document comprising an antenna support and a second substrate assembled to the first substrate so that the antenna is trapped between the two substrates, an open cavity having a bottom into which at least one machined section opens. a rectilinear portion forming the antenna ends, electrical connection means at least partially covering the machined sections of the antenna wire, a microcircuit module encircled in the cavity and in electrical contact with the machined sections via connection means.
    [0004] Thanks to these provisions, the detours are embedded in the material constituting the substrate. The detours are thus not only maintained by the material of the substrate, but also located below the machining plane, and therefore not exposed to the milling cutter. These provisions considerably reduce the risk of detaching detours. According to other characteristics: the detours are incrusted with a depth of at least 20 μm in relation to the rectilinear parts; the electrical connection means is an anisotropic adhesive covering the machined sections of the rectilinear parts; - The cavity is formed of a first countersink and a secondary countersink formed in the first countersink, the machined sections opening into the bottom of the first countersink.
    [0005] The invention also relates to a method of manufacturing an antenna support which comprises at least one step of embedding the wire antenna in the first substrate by means of a tool adapted to distribute and embed the wire, the tool moving at a speed relative to the substrate, the velocity v1 detaching detours being at most equal to 0.75 times the velocity v2 of removal of the rectilinear parts; According to other features: the method comprises at least one step of embedding the wire antenna in the first substrate by means of a tool adapted to distribute and embed the wire and exerting a bearing force against the first substrate , the applied bearing force for the removal of the detours being at least equal to 1.25 times the force applied for the removal of the rectilinear parts; the method comprises at least one step of embedding the wire antenna in the first substrate by means of a tool adapted to distribute and embed the wire by ultrasound at a determined frequency, the frequency applied for the removal of the detours being at less than 1.25 times the frequency applied for the removal of straight parts; the rectilinear parts are spaced apart from one another by an interval at least equal to once the diameter of the antenna wire; the method of manufacturing an electronic document comprises the following steps: manufacturing an antenna support, assembling at least one second substrate by a rolling step, machining an open cavity and having a depth such that a machined section of a rectilinear portion opens into the bottom of the cavity, placing the microcircuit module in the cavity and electrical connection between the module and the ends of the antenna; - The machining is performed so that the machined section of a rectilinear portion has a width between 0.4 and 0.6 times the diameter of the antenna wire. the manufacturing method comprises a step of depositing an anisotropic adhesive between the module and the bottom of the cavity, prior to the step of setting up the microcircuit module, then a step of compressing the module in the cavity to adhere the module into the cavity and activate the electrical connection. The present invention will be better understood on reading the detailed description given with reference to the accompanying drawings, in which: FIG. 1 is an elevational view of an antenna support according to the invention; FIG. cut along AA of the antenna support illustrated in Figure 1, and Figure 2b is a sectional view along a plane perpendicular to the plane AA, Figures 3a and 3b respectively show views similar to the views 2a and 2b of machined rectilinear parts FIG. 4 illustrates a perspective view of a microcircuit card comprising an antenna support according to the invention.
    [0006] A microcircuit card 10 illustrated in FIG. 4 comprises a plastic body 12 delimited between a front face 12a and a rear face 12b. This body 12 is a thin plastic plate. The dimensions of the cards are specified in IS07810 and 1507816 and have the following values: 85mm * 54mm * 0.76mm. The thickness is negligible compared to its dimensions in width and length.
    [0007] Such a body 12 is made by any means. A conventional means is hot rolling of plastic layers. The layers have various functions. Thus, a central inner layer or substrate may be a structural layer giving the body 12 and the card 10 its rigidity or serve as a support for an electronic component. Intermediate layers, on both sides of the substrate, may comprise inscriptions or decorations with an informative or decorative function.
    [0008] External layers, advantageously transparent, typically terminate the stack and provide surface protection of the more internal layers. The card 10 further comprises a microcircuit module 14, formed of a thin-circuit printed circuit board. The printed circuit board has an inner face 14a on which is mounted a chip 16, or microcircuit. The outer face 14b of the printed circuit board comprises metallized contact surfaces 18 connected on the one hand to the microcircuit and intended to come into contact with pins of an external reader on the other hand. The metallized contact surfaces 18 thus allow the card 10 to communicate with an external terminal by physical contact. In addition, the internal face 14a of the module 14 comprises connection pads 15 connected to the microcircuit and intended to be electrically connected with an electronic component disposed in the body 12 of the card 10. In the body 12 of the card 10 is made a cavity 20 opens and opens on the front face 12a of the card 10. The card 10 receives the microcircuit module 14. This cavity 20 comprises a first countersink 22 and a secondary countersink 24, made in the first countersink 22, and to leave room for the microcircuit.
    [0009] Dual cards are also known which are adapted to communicate either with external readers by physical contact with pins as described above or remotely, without physical contact, by means of an antenna 26. These cards integrate then such an antenna 26 in its body 12. For this purpose an antenna support 28 forms an inner layer of the card 10 and is inserted between the other layers before the rolling operation. The antenna support 28 is formed of a plastic substrate 30, such as PET, PVC or polycarbonate, delimited by two opposite faces 30a, 30b defining between them the thickness of the substrate 30. A wire forming the Antenna 26 is unwound and inlaid on the antenna support 28, then it is covered by the other layers and then laminated with these layers. The antenna 26 consists of a winding. It comprises at least one turn 26a and two ends 26b, 26c between which extends the turn 26a. The ends 26b, 26c of the antenna 26 each have a zigzag shape formed of at least two rectilinear portions 32 and two detours 34 as visible in FIGS. 1 and 4. The antenna wire 26 is embedded in the thickness of the first substrate 30 from a first face 30a so that the rectilinear portions 32 extend substantially in the same plane, that is to say in section, in a plane perpendicular to the plane of the substrate 30 the rectilinear portions 32 extend along a straight line parallel to the plane of the support. In order to improve the maintenance of the detours 34 and to considerably reduce their risk of tearing during the machining step, the invention proposes an antenna support 28 in which the detours 34 are embedded deeper than the rectilinear parts. 32 in the thickness of the antenna support 28 from the first face 30a.
    [0010] For this purpose the detours 34 are embedded at a depth p of about 20gm minimum relative to the straight portions 32 from the first face 30a. But this value can be modified according to the thickness of the support and the initial diameter of the wire. The offset of 20 gm is estimated between the respective central axes of a rectilinear part and a detour, as can be seen in FIG. 2a. The larger the initial diameter of the wire forming the antenna, the greater the offset can be. By virtue of these arrangements, the detours 34 are protected by the material of the substrate 30 into which they are inserted. This shows a risk of tearing the ends 26b, 26c of the antenna 26 greatly decreased compared to the solutions of the prior art. The machining of the open cavity 20 to accommodate a module 14, will show the straight portions 32 of the ends 26b, 26c of contact. The machining will make it possible to make the cavity 20 and the depth of this cavity 20 is determined so that the rectilinear portions 32 open into the bottom of the cavity 20. Moreover, advantageously, this operation makes it possible to strip the rectilinear portions 32 by surface to remove any insulation material such as enamel or sheath. With the provisions of the present invention, the cutter performs a machining of the rectilinear portions 32 in a machining plane located above the plane of the detours 34. In a preferred embodiment, the cavity 20 comprises two countersinks 22, 24 and machined sections 31 of the straight portions 32 open into said first countersink 22 and are flush with the bottom of the first countersink 22, which corresponds to the surface on which the module 14 bears. The ends 26b, 26c of the antenna 26 are electrically connected with the microcircuit via the connection pads 15 disposed on the internal face 14a of the module 14. The machined sections 31 of the rectilinear portions 32 and the connection pad connected to the chip 16 of the module 14 are arranged facing so as to obtain a large electrical connection area. The ends 26b, 26c of the antenna 26 are thus at least partially accessible to make an electrical connection. In order to guarantee a good electrical connection between the module 14 and the ends 26b, 26c of the antenna 26, it is preferable to have a sufficient contact surface between the ends 26b, 26c of the antenna 26 and the connection pad of the module 14. This sufficient contact area is determined by the machined wire surface and accessible from the bottom of the first countersink 22. The amount of wire deposited depends on the diameter of the initial wire. The material gap between each rectilinear portion 34 depends on the diameter of the wire. In particular, the minimum distance between two rectilinear parts increases as the diameter of the wire increases, so as to clear a minimum area of the plastic substrate 30 used for the adhesion of the module 14. Preferably, the minimum interval is at least equal to once the diameter of the antenna wire 26. The antenna support 28 is made by a method known from the prior art and briefly described in the preamble of the present description. The method is implemented by a tool comprising means for distributing the antenna wire and embedding it in the substrate 30 of the antenna support 28. For this purpose the tool comprises a distribution means such as a nozzle adapted to progressively discharge the wire on the substrate 30. The tool also comprises control means for changing the parameters of the speed of movement of the nozzle and the speed of distribution of the wire. Optionally, the tool comprises control means for modifying the force applied during the removal of the wire. For this purpose, if the wire is deposited by means of a sonotrode, it may be envisaged to modify the frequency and the amplitude of the ultrasonic vibrations. Indeed, the higher the frequency, the more the wire is embedded in the substrate.
    [0011] Advantageously, the returns are deposited by means of a sonotrode subjected to ultrasound at a frequency at least equal to 1.25 times the frequency applied for the rectilinear parts. Finally, the tool may comprise heating means for effecting local heating resulting in a slight melting of plastic and / or the sheath of the wire. Thus, the method includes a step of embedding the wire antenna in the first substrate 30 by means of of the tool moving at a speed relative to the substrate 30, the speed v1 of removing the detours 34 being at most equal to 0.75 times the speed v2 of removal of the straight portions 32. Preferably, the speed v1 is included between 0.3 and 0.5 times the speed v2. Thanks to the slowing down of the tool during the removal of the wire, the detours 34 have a longer encrustation time which has the effect of positioning them more deeply than the rectilinear parts 32. According to an alternative embodiment, the method of manufacturing comprises an incrustation step in which the bearing force applied against the first substrate 30 for the removal of the detours 34 is at least equal to 1.25 times the force applied for the removal of the straight portions 32. These provisions guarantee a deeper penetration of the detours 34 in the substrate 30. According to a preferred embodiment, the parameters of the wire-encrusting tool in the substrate 30 are modified to slow down and exert a greater force during the removal of the detours 34. rectilinear portions 32 are deposited in the substrate 30 so that they align substantially parallel to each other and are spaced apart by a minimum interval imum. In addition, the rectilinear portions 32 are substantially embedded in the same inlay plane itself parallel to the outer face 12a of the substrate 30. These arrangements ensure that the rectilinear portions 32 are positioned at a constant depth so as to guarantee a window. the largest machining possible. The depth of the cavity 20 is then chosen so that the rectilinear portions 32 of the ends 26b, 26c of the antenna are brushed in a plane substantially parallel to the plane of the first substrate 30 so as to make accessible at least one machined section 31 of the parts rectilinear. Side views of the machined sections 31 are shown in Figures 3a and 3b. Advantageously, the machined section is made in a thickness of between 10% and 40% of the diameter of the wire forming the antenna. The invention also relates to a method of manufacturing an electronic document, such as a bank format card or an identity card whose dimensions are specified in ISO 7816 standards. The manufacturing method consists of integrating the support antenna 28 previously described in a card body 12. For this purpose, the antenna support 28 is assembled with other plastic layers, such as PET, PVC or polycarbonate by a laminating method. hot to adhere the different layers together. The obtained card body 12 is then machined so as to form a cavity 20 opening on the front face 12a of the card body 10. The machining depth is determined according to the position of the ends 26b, 26c of the antenna in the The thickness of the card body 12 is particularly 10. The depth of the cavity 20 is determined so that the rectilinear portions 32 of the ends 26b, 26c of the antenna are partially machined. A machined section 31 of the rectilinear portions 32 is then accessible and is intended to be electrically connected to the contact pads of the module 14.
    [0012] An anisotropic adhesive is then deposited on the bottom of the cavity 20 or on the internal face 14a of the module 14. This adhesive will make it possible to hold the module 14 in place and has electrical conductivity properties to allow the electrical connection between the machined sections. 31 and the contact pads of the module 14. The module 14 is then placed in the cavity 20 so that the pads are arranged opposite the ends 26b, 26c of the antenna, then the module 14 is then inserted, c 'i.e. set up and compressed to make the anisotropic adhesive conductive in one direction.
    权利要求:
    Claims (13)
    [0001]
    REVENDICATIONS1. Antenna carrier for integration in an electronic document, the carrier comprising: - a first plastic substrate (30) delimited by opposite first and second faces (30a, 30b) defining between them a substrate thickness (30); ), an antenna comprising at least one turn (26a) extending between two ends (26b, 26c), the antenna being formed of a wire embedded in the thickness of the first substrate (30) from the first face (30a), the two ends (26b, 26c) each having a zigzag shape formed of at least two rectilinear parts (32) and two detours (34), characterized in that the detours (34) are embedded more deeply than the straight portions (32) in the thickness of the first substrate (30) from the first face (30a).
    [0002]
    2. Antenna support according to claim 1 wherein the detours (34) are embedded with a depth at least equal to 20gm relative to the straight portions (32).
    [0003]
    An electronic document comprising: - an antenna support (28) according to claim 1 or 2, - and a second substrate assembled to the first substrate (30) so that the antenna is trapped between the two substrates, - a cavity (20) open comprising a bottom into which at least one machined section (31) of a rectilinear part of the ends (26b, 26c) of the antenna, - an electrical connection means at least partially covering the machined sections (31 ) of a rectilinear part of the ends (26b, 26c) of the antenna, - a microcircuit module (14) inserted and fixed in the cavity (20) and in electrical contact with the machined sections (31) via connection means.
    [0004]
    An electronic document according to claim 3, wherein the electrical connection means is an anisotropic adhesive covering the machined sections (31) of the rectilinear portions (32).
    [0005]
    5. Electronic document according to claim 3 or 4, wherein the cavity (20) is formed of a first countersink (22) and a secondary countersink (24) formed in the first countersink (22), the machined sections opening in the bottom of the first countersink (22).
    [0006]
    6. A method of manufacturing an antenna support according to one of claims 1 or 2, characterized in that it comprises at least one step of embedding the antenna (26) wire in the first substrate (30). ) by means of a tool adapted to distribute and embed the wire.
    [0007]
    7. The manufacturing method according to claim 6, wherein the tool moves at a speed relative to the substrate (30), the speed v1 detaching detours (34) being at most equal to 0.75 times the speed v2 removing rectilinear portions (32).
    [0008]
    8. Manufacturing process according to claim 6 or 7, wherein the tool exerts a bearing force against the first substrate (30), the applied bearing force for the removal of the detours (34) being at least equal to 1.25 times the applied force for the removal of straight parts.
    [0009]
    9. Manufacturing method according to one of claims 6 to 8, wherein the tool distributes and incrust the son by ultrasound at a predetermined frequency, the frequency applied for the removal of the detours (34) being at least 1, 25 times the applied frequency for the removal of straight parts.
    [0010]
    10. A method of manufacturing an antenna support according to one of claims 6 to 9, wherein the rectilinear portions (32) are spaced relative to each other by an interval at least equal to once the diameter. antenna wire (26).
    [0011]
    11. A method of manufacturing an electronic document according to one of claims 3 to 5, characterized in that it comprises the following steps: - manufacture of an antenna support (28) according to the method of one claims 6 to 10, - assembly of at least one second substrate (30) by a rolling step, machining an open cavity (20) and having a depth such that a machined section of a rectilinear part opens in the bottom of the cavity (20), - placing the microcircuit module (14) in the cavity (20) and electrical connection between the module (14) and the ends (26b, 26c) of the antenna (26). ).
    [0012]
    12. A method of manufacturing an electronic document according to claim 11, wherein the machining is performed so that the machined section (31) of a rectilinear portion has a width between 0.4 and 0.6 times the diameter of the antenna wire (26).
    [0013]
    13. The manufacturing method according to claim 11 or 12, comprising a step of depositing an anisotropic adhesive between the module (14) and the bottom of the cavity, prior to the step of placing the module (14) to microcircuit, then a step of compressing the module (14) in the cavity (20) to adhere the module (14) in the cavity (20) and activate the electrical connection.
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    法律状态:
    2015-06-25| PLFP| Fee payment|Year of fee payment: 2 |
    2016-01-08| PLSC| Search report ready|Effective date: 20160108 |
    2016-06-22| PLFP| Fee payment|Year of fee payment: 3 |
    2017-06-21| PLFP| Fee payment|Year of fee payment: 4 |
    2018-06-21| PLFP| Fee payment|Year of fee payment: 5 |
    2020-06-23| PLFP| Fee payment|Year of fee payment: 7 |
    2021-06-23| PLFP| Fee payment|Year of fee payment: 8 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1456270A|FR3023419B1|2014-07-01|2014-07-01|ANTENNA CARRIER TO BE INTEGRATED IN AN ELECTRONIC DOCUMENT|FR1456270A| FR3023419B1|2014-07-01|2014-07-01|ANTENNA CARRIER TO BE INTEGRATED IN AN ELECTRONIC DOCUMENT|
    PCT/FR2015/051783| WO2016001569A1|2014-07-01|2015-06-30|Antenna carrier intended for being built into an electronic document|
    EP15753716.8A| EP3164908B1|2014-07-01|2015-06-30|Antenna carrier intended for being built into an electronic document|
    CN201580045354.0A| CN106575814B|2014-07-01|2015-06-30|Antenna mounting part and its manufacturing method, electronic document and its manufacturing method|
    PL15753716T| PL3164908T3|2014-07-01|2015-06-30|Antenna carrier intended for being built into an electronic document|
    US15/322,592| US10320066B2|2014-07-01|2015-06-30|Antenna carrier intended for being built into an electronic document|
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